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FY2025 Financial Announcement February 13 , 2026 Security Code: 6266 https://tazmo.co.jp/wp/wp-content/uploads/2025/11/company%20guide.pdf Company Guide January 2025 – December 2025
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INDEX 目次 2© 2024 TAZMO Co.,Ltd. 01 FY2025 Consolidated Financial Summary 02 FY2025 Segment Information 03 FY2026 Financial Estimates 04 Appendix
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3© 2024 TAZMO Co.,Ltd. FY2025 Consolidated Financial Summary (January 2025 - December 2025) 01
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4 © 2024 TAZMO Co.,Ltd. 3,541 million Yen YoY Change △16.6% 5,009 million Yen YoY Change △16.5% 4,768 million Yen YoY Change △19.4% 35,428 million Yen YoY Change △1.2% FY2025 Financial Highlights Sales and profits of semiconductor equipment in the Process Equipment Business and surface treatment equipment in the Surface Treatment Equipment Business remained steady. Net sales Operating income Ordinary income Net income(*) ▍概況 ◼ In the Process Equipment Business, sales of semiconductor equipment were driven by the smooth inspection and acceptance of equipment for advanced packaging applications. ◼ Transfer equipment sales declined due to weaker demand from equipment manufacturers and slower expansion in the Chinese market. ◼ Cleaning equipment recorded a significant decline in sales, as capital investment by wafer manufacturers remained sluggish. ◼ In the Surface Treatment Equipment Business, inspection and acceptance progressed as planned, and despite the impact of market slowdown, higher profits were achieved. 4
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5 © 2024 TAZMO Co.,Ltd. FY2025 Revised estimates Cf. Revised estimates (%) FY2025 Initial estimates cf. Initial estimates (%) 36,000 98.4 41,000 86.4 － － － － Unchanged － 5,000 95.4 Unchanged － 5,100 98.2 Unchanged － 3,500 101.2 － － － － （Millions of yen） FY2024 (Actual) FY2025 YoY change (%)Actual Net sales ratio (%) Net sales 35,865 35,428 － △1.2 Gross profit 11,855 10,758 30.4 △9.2 Operating income 5,917 4,768 13.5 △19.4 Ordinary income 5,998 5,009 14.1 △16.5 Net income attributable to owners of parent 4,247 3,541 10.0 △16.6 ROE 19.3％ 14.0％ － △5.3P Financial Summary Sales declined due to weaker order intake for cleaning equipment, transfer equipment, and projects related to panel-level packaging .Profits declined as the share of equipment for advanced packaging applications increased within semiconductor equipment in the Process Equipment Business.
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6 © 2024 TAZMO Co.,Ltd. 11,329 17,169 19,036 18,223 19,516 22,001 24,356 28,161 35,865 35,428 1,346 1,672 1,606 951 1,886 2,092 2,806 3,654 5,917 4,768 11.9% 9.7% 8.4% 5.2% 9.7% 9.5% 11.5% 13.0% 16.5% 13.4% FY2016 FY2017 FY2018 FY2019 FY2020 FY2021 FY2022 FY2023 FY2024 FY2025 0.0% 5.0% 10.0% 15.0% 20.0% 25.0% 0 10,000 20,000 30,000 FY2016 FY2017 FY2018 FY2019 FY2020 FY2021 FY2022 FY2023 FY2024 FY2025 Net Sales Operating income Operating margin Trend in Net sales and Operating profit 0 （Millions of yen）
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7 © 2024 TAZMO Co.,Ltd. （Millions of yen） FY2024 FY2025 YoY change(%) Current assets 40,731 37,809 △2,921 Non-current assets 8,469 9,083 613 Property, plant and equipment 7,385 7,812 427 Intangible assets 156 199 43 Investments and other assets 927 1,070 143 Total assets 49,200 46,893 △2,307 Current Liabilities 17,696 14,393 △3,303 Non-Current Liabilities 6,861 5,462 △1,398 Total liabilities 24,557 19,855 △4,702 Total net assets 24,642 27,037 2,394 Equity ratio 49.1% 56.6％ 7.5P ▍Current Liabilities ▍Non-Current Liabilitie Balance Sheet Major change ▍Current Assets Cash and deposits ＋5,931 Notes and accounts receivable - trade △2,663 Electronically recorded monetary claims - operating △1,003 Work in process △4,213 Raw materials and supplies △675 Electronically recorded obligations - operating △1,894 Short-term borrowings 452 Contract liabilities △1,592 Long-term borrowings △1,355 The financial position improved due to an increase in cash and deposits, as well as a decrease in work in process. （Millions of yen）
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8© 2024 TAZMO Co.,Ltd. 13,574 17,549 20,095 24,642 27,037 10,663 13,906 15,810 15,742 11,929 5,151 7,941 11,522 8,815 7,926 0 10,000 20,000 30,000 40,000 50,000 2021 2022 2023 2024 2025 Interest-bearing debt Other liabilities Net assets 0 29,390 7,314 7,491 8,008 8,469 9,083 746 2,415 1,959 866 566 11,384 17,983 22,173 20,294 15,410 6,677 6,365 8,387 9,226 5,5593,267 5,141 6,899 10,343 16,274 0 10,000 20,000 30,000 40,000 50,000 2021 2022 2023 2024 2025 Cash equivalent Trade receivable Investors Other current assets Noncurrent assets 29,390 39,397 47,428 47,428 Balance Sheet ▍Assets ▍Liabilities/Equity 39,397 0 49,200 49,200 46,893 46,893 （Millions of yen） （Millions of yen）
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9 © 2024 TAZMO Co.,Ltd. （Millions of yen） FY2024 FY2025 YoY change(%) Cash flow from operating activities 7,506 9,425 1,918 Cash flow from investing activities △1,710 △ 3,181 1,470 Free cash flow 5,796 6,244 448 Cash flow from financing activities △3,163 △ 1,961 1,202 Cash on hand 9,733 13,946 4,213 Cash Flow Cash flows from operating activities improved due to a significant decrease in inventories, among other factors. ▍Cash flow from operating activities Profit before income taxes 5,008 Decrease (increase) in inventories 4,863 Decrease (increase) in trade receivables 3,621 Increase (decrease) in trade payables △1,926 Income taxes paid △1,912 ▍Cash flow from investing activities Net decrease (increase) in time deposits △1,702 Purchase of property, plant and equipment △1,421 ▍Cash flow from financing activities Net increase (decrease) in short-term borrowings 2,000 Repayments of long-term borrowings △3,113 Highlights （Millions of yen）
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10© 2024 TAZMO Co.,Ltd. FY2025 Segment Information02
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11 © 2024 TAZMO Co.,Ltd. （Millions of yen） FY2024 Actual FY2025 Actual YoY(%) Process equipment business Net sales 28,733 27,475 △4.4 Operating income 5,484 4,089 △25.4 ◼ Semiconductor equipment Net sales 12,320 17,212 39.7 ◼ Transfer equipment Net sales 8,318 7,657 △7.9 ◼ Cleaning equipment Net sales 5,634 1,756 △68.8 ◼ Coater Net sales 2,461 848 △65.5 Precision molding dies and plastic moldings business Net sales 779 1,198 53.8 Operating income △128 56 － Surface treatment equipment business Net sales 6,352 6,754 6.3 Operating income 578 602 4.1 Elimination of inter- segment transactions Operating income △17 19 － Total Net sales 35,865 35,428 △1.2 Operating income 5,917 4,768 △19.4 FY2025 Revised estimates Cf. Revised estimates (%) FY2025 Initial estimates cf. Initial estimates (%) 33,000 83.3 4,500 90.9 18,200 94.6 9,300 82.3 3,700 47.5 1,800 47.1 1,100 108.9 50 112.0 6,900 97.9 450 133.8 － － 36,000 98.4 41,000 86.4 Unchanged － 5,000 95.4 Net Sales and Operating Profit by Segment
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12 © 2024 TAZMO Co.,Ltd. 12,320 17,212 8,318 7,657 5,634 1,756 2,461 848 FY2024 FY2025 Coater Cleaning equipment Transfer equipment Semiconductor equipment 5,484 4,089 FY2024 FY2025 Process Equipment Business ◼ Semiconductor equipment：Sales and profits were driven primarily by the inspection and acceptance of equipment for advanced packaging applications. ◼ Transfer equipment：Sales declined due to lower demand from equipment manufacturers. ◼ Cleaning equipment：Sales declined due to sluggish capital investment by wafer manufacturers. ◼ Coater：Focus on PLP-related equipment; to be integrated into semiconductor equipment from FY2026. ▍Net sales ▍Operating income （Millions of yen） （Millions of yen） ✓ Demand for advanced packaging equipment related to AI applications has remained relatively firm and continues to support the overall semiconductor market. ✓ While sales of equipment for power semiconductors declined year on year, capital investment driven by increasing electricity demand is expected over the medium to long term. ✓ Development of panel-level packaging (PLP) for advanced packaging is progressing, and increased investment in equipment for both prototyping and mass production is expected. ✓ Overall capital investment in the semiconductor market, excluding AI-related segments, has remained sluggish. Highlights Business environment 28,733 27,475
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13 © 2024 TAZMO Co.,Ltd. ▍Net sales ▍Ordinary income 6,352 6,754 FY2024 FY2025 578 602 FY2025 FY2025 Surface treatment equipment business / Precision molding dies and plastic moldings business （Millions of yen） Surface treatment equipment business By improving estimation accuracy and promoting unitization to reduce man-hours, the Company achieved year-on-year increases in both sales and profits. In addition, inspection and acceptance progressed for large-scale projects that had previously been delayed in delivery and acceptance, contributing to higher sales and profits. Sales and profits improved due to a recovery in order intake year on year and ongoing reforms to the cost structure. As sluggish conditions in the Chinese market persist, the Company implemented a transformation of the business structure by narrowing the scope of this business and reducing fixed costs, including the reassignment of personnel to other businesses. ▍Net sales ▍Ordinary income -128 56 FY2024 FY2025 779 1,198 FY2024 FY2025 （Millions of yen） Precision molding dies and plastic moldings business
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© 2024 TAZMO Co.,Ltd. 14 Trend in Net sales by Segment （Quarter） 383 1,212 857 2,150 1,150 1,559 1,144 2,143 489 1,242 2,611 2,429 1,516 4,743 3,704 2,356 2,246 4,446 6,239 4,280 1,382 1,390 1,188 1,565 1,812 1,667 1,628 2,028 1,825 2,138 2,176 1,795 1,721 1,921 2,218 2,455 1,783 2,127 1,781 1,965 938 344 768 1,678 287 942 392 1,242 476 1,164 963 2,349 608 1,681 1,465 1,877 502 691 149 412 864 900 677 1,223 1,591 967 79 555 89 431 888 1,365 1,526 156 172 605 271 124 168 284 626 935 249 1,089 789 1,302 566 1,104 627 1,179 1,592 867 381 1,675 749 3,546 2,419 1,568 1,679 1,088 369 393 391 417 404 411 261 322 357 412 367 319 150 155 188 284 293 312 308 282 0 2,000 4,000 6,000 8,000 10,000 12,000 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Precision molding dies and plastic moldings business Surface treatment equipment business Coater Cleaning equipment Transfer equipment Semiconductor equipment 4,564 5,178 4,133 6,848 6,036 8,125 3,864 7,397 4,072 9,127 8,599 6,569 2021 2022 2023 2024 5,905 10,334 8,499 11,125 2025 7,516 9,270 10,326 8,314 （Millions of yen）
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© 2024 TAZMO Co.,Ltd. 15 Trend in Sales Orders by Segment （Quarter） 1,922 2,044 2,080 2,374 2,424 2,488 2,421 3,603 2,058 1,490 5,557 4,771 419 4,627 2,343 5,548 1,254 1,821 5,244 2,647 1,533 1,622 1,818 2,400 2,102 2,991 2,088 1,861 1,757 1,269 1,305 1,948 1,700 1,847 2,193 1,937 2,004 1,921 1,067 1,755 768 1,164 887 5,815 1,006 1,066 625 820 364 280 434 1,463 301 183 648 573 282 542 193 485 667 530 976 1,729 568 94 241 119 0 311 899 228 251 36 172 50 147 238 126 1,062 1,164 736 1,283 1,188 1,840 4,915 1,506 734 317 2,180 1,157 410 1,175 598 1,253 502 580 1,250 622 432 484 409 398 431 402 240 304 308 374 321 281 150 142 190 309 336 322 257 282 0 2,000 4,000 6,000 8,000 10,000 12,000 14,000 16,000 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Precision molding dies and plastic moldings business Surface treatment equipment business Coater Cleaning equipment Transfer equipment Semiconductor equipment 6,908 14,002 6,387 7,011 7,723 8,884 10,533 8,215 5,225 4,044 10,699 9,851 2,995 8,226 6,010 9,796 4,430 5,336 2021 2022 2023 2024 2025 8,252 5,919 （Millions of yen）
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16 © 2024 TAZMO Co.,Ltd. Trend in Order Backlog by Segment 3,089 3,921 5,144 5,369 6,642 7,572 8,849 10,310 11,879 12,127 15,073 17,415 16,317 16,201 14,840 18,033 17,042 14,417 13,423 11,789 2,415 2,647 3,277 4,111 4,401 5,725 6,185 6,018 5,951 5,082 4,211 4,364 4,343 4,268 4,243 3,725 3,946 3,740 3,026 2,816 2,914 3,734 3,853 7,989 8,708 8,833 9,066 8,644 8,532 7,649 7,119 6,234 5,927 4,429 3,612 2,308 2,087 1,938 1,982 2,054 6,397 6,027 6,325 6,831 5,808 4,936 5,098 4,661 4,573 4,452 4,464 3,327 1,812 1,907 1,770 1,337 1,117 1,140 1,210 1,052 1,765 1,994 2,481 2,676 3,075 3,613 7,962 8,364 8,471 7,608 8,196 8,487 8,516 8,017 7,866 5,573 3,656 2,668 2,240 1,774 257 348 366 347 375 366 345 326 277 239 194 156 156 142 144 170 212 221 170 170 0 5,000 10,000 15,000 20,000 25,000 30,000 35,000 40,000 45,000 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Precision molding dies and plastic moldings business Surface treatment equipment business Coater Cleaning equipment Transfer equipment Semiconductor equipment 2021 2022 2023 2024 16,840 18,674 21,449 27,326 29,012 31,047 37,507 38,325 39,685 37,160 39,260 39,984 2025 37,073 34,966 32,477 31,148 28,062 24,127 22,053 19,658 （Millions of yen）
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© 2024 TAZMO Co.,Ltd. 17 Trend in Net sales by Segment （Full year） 2,732 3,975 2,739 2,553 4,046 4,603 5,997 6,773 12,320 17,212 3,429 4,358 4,692 5,729 5,320 5,526 7,136 7,936 8,318 7,657 1,702 1,558 2,400 1,905 2,760 3,730 2,864 4,954 5,634 1,756 2,012 2,490 4,383 2,411 2,547 3,666 3,193 2,774 2,461 848 3,074 3,089 4,185 3,489 2,900 3,763 4,267 6,352 6,754 1,451 1,712 1,731 1,437 1,352 1,572 1,400 1,456 779 1,198 0 5,000 10,000 15,000 20,000 25,000 30,000 35,000 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 Precision molding dies and plastic moldings business Surface treatment equipment business Coater Cleaning equipment Transfer equipment Semiconductor equipment 11,329 17,169 19,036 18,223 19,516 22,001 24,356 28,161 35,865 35,428 （Millions of yen）
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© 2024 TAZMO Co.,Ltd. 18 Trend in Sales Orders by Segment （Full year） 2,680 3,710 2,072 3,277 3,271 8,422 10,938 13,878 12,938 10,968 3,539 4,677 5,206 5,342 5,805 7,373 9,043 6,281 7,679 6,749 1,370 2,944 2,858 2,959 2,528 8,636 3,519 2,543 1,708 1,503 4,348 3,128 3,636 2,348 5,346 3,904 1,023 1,439 471 563 1,775 4,662 3,805 2,991 4,246 9,450 4,390 3,438 2,955 1,517 1,719 1,732 1,430 1,344 1,725 1,378 1,286 793 1,198 0 5,000 10,000 15,000 20,000 25,000 30,000 35,000 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 Precision molding dies and plastic moldings business Surface treatment equipment business Coater Cleaning equipment Transfer equipment Semiconductor equipment 13,456 17,955 20,168 19,164 21,288 34,309 35,355 29,820 27,028 23,938 （Millions of yen）
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19© 2024 TAZMO Co.,Ltd. FY2026 Financial Estimates 03
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20 © 2024 TAZMO Co.,Ltd. （Millions of yen） H2 Full year YoY changes （％） Net sales 15,570 35,500 0.2 Process equipment business 12,870 29,700 8.1 Precision molding dies and plastic moldings business 600 1,300 8.5 Surface treatment equipment business 2,100 4,500 △33.4 Operating income 890 3,600 △24.5 Process equipment business 900 3,400 △16.9 Precision molding dies and plastic moldings business 30 70 23.9 Surface treatment equipment business △40 130 △78.4 Ordinary income 800 3,500 △30.1 Net income attributable to owners of parent 600 2,500 △29.4 FY2026 Financial Estimates
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21 © 2024 TAZMO Co.,Ltd. 17,212 18,500 7,657 8,860 1,756 2,340848 6,754 4,500 1,198 1,300 0 5,000 10,000 15,000 20,000 25,000 30,000 35,000 40,000 2025 (Actual) 2026 (Estimates) Precision molding dies and plastic moldings business Surface treatment equipment business Coater Cleaning equipment Transfer equipment Semiconductor equipment 35,428 35,500 4,089 3,400 602 130 56 70 19 -100 900 1,900 2,900 3,900 4,900 5,900 2025 (Actual) 2026 (Estimates) Elimination of inter-segment transactions Precision molding dies and plastic moldings business Surface treatment equipment business Process equipment business 3,600 4,768 Net sales and Operating profit Estimates by Segment ▍Net sales ▍Operating income （Millions of yen） （Millions of yen） Note: From the fiscal year ending December 2026, the “Coater” will be reported as part of the “Semiconductor equipment”.
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22 © 2024 TAZMO Co.,Ltd. 1,025 1,524 1,239 1,520 7,000 0 1,000 2,000 3,000 4,000 5,000 6,000 7,000 8,000 2022 2023 2024 2025 2026 （E） 698 757 920 974 1,400 0 200 400 600 800 1000 1200 1400 1600 2022 2023 2024 2025 2026 （E） 367 435 699 732 1,200 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 2022 2023 2024 2025 2026 （E） FY2026 Capex/Depreciation and amortization/R&D Expenses ▍Capital expenditures ▍Depreciation and amortization ▍R&D expenses （Millions of yen） （Millions of yen） （Millions of yen）
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23 © 2024 TAZMO Co.,Ltd. FY2026 Cash Allocation Use of cash Cash funding Through capital investments in Ibara City, Okayama Prefecture, and Taiwan— including demonstration equipment—we aim to further expand production capacity and achieve more efficient manufacturing. 60 (billions of yen)(billions of yen) 60 ⚫ Capital expenditures 70 ⚫ Dividends 5 ⚫ Repayment of long-term borrowings 30 ⚫ Net change in working capital 14 ⚫ Net change in cash and cash equivalents △59 ⚫ Net income 23 ⚫ Depreciation and amortization 14 ⚫ Long-term borrowings 23
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© 2024 TAZMO Co.,Ltd. 24 LAB： Laser Assisted Bonder ＜ Existing process ＞ Heat and press the entire wafer to bond ＜Countermeasure Process（LAB）＞ Aiming to achieve a hermetic seal for the MEMS sensor while keeping the MEMS sensor section at a low temperature through localized heating with a laser. Existing Process Issues TAZMO LAB Advantages • Concern over uneven bonding strength and unbonded areas. • Whole-wafer heating limits compatibility to heat-resistant MEMS only. • MEMS heating can generate gas, making high vacuum difficult to maintain. • Heating and cooling take time, slowing the overall process. • Materials with different CTEs may deform or warp. • Uniform bonding strength across the entire wafer.Bonduniformity unaffected by TTV. • Only the bonding line is heated, enabling low-temperature bonding of device areas. • Suppressed degassing inside MEMS cavities allows high-vacuum sealing. • Low-temperature bonding across the wafer enables joining of materials with different CTEs. • High energy efficiency with low power consumption. In 2025, We Expanded Beyond MEMS Device Sealing to include heterogeneous material bonding, SiC–SiC bonding, and temporary bonding; by evaluating compatibility on each customer’s actual devices, we strengthened our technological foundation for new applications and future business opportunities. MEMS Chip Bonding interface: 450°C peakInside the cavity ：<150℃ MEMS Chip WLP (Wafer-Level Packaging) process Inside the cavity: high temperature
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© 2024 TAZMO Co.,Ltd. 25 0 2 4 6 8 10 12 14 16 2025 2026 2027 2028 2029 2030 2031 （Units ） Shipment Forecast（2025-2031） AP Power MEMS LAB Future Prospects 0 5 10 15 20 2025 2026 2027 2028 2029 2030 $B MEMS Market Forecast 参考：yintr25516-status_of_the_mems_industry_2025.pdf 0 2 4 6 8 10 2025 2026 2027 2028 2029 2030 $B SiC Power Device Market Forecast 参考：Silicon Carbide Power Semiconductor Market Size & Share 2030 0 20 40 60 80 100 2025 2026 2027 2028 2029 2030 $B Advanced Packaging Market Forecast 参考：Status_of_the_advanced_packaging_industry_2025_YOLE.pdf LAB Technologies as the Core for Expansion from MEMS to Power and Advanced Packaging Equipment Sales Begin This Fiscal Year Market expansion driven by the first unit sale in early 2026.
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© 2024 TAZMO Co.,Ltd. 26 C2W bonding system （DTB：Direct Transfer Bonder ） Direct bonding of tape-carried chips ⇒High-precision bonding without particle or residue contamination Development of a New Chiplet-Based CoW Bonding System We will build a demo unit this fiscal year and accelerate initiatives toward concrete customer orders. Flip Chip Bonder TAZMO DTB Chip Pick up Yes ⇒ Possible chip contamination No ⇒Maintains high cleanliness Chip Handling Chip-by-chip ⇒ Size limitation Tape transport ⇒ Size-free Alignment Camera insertion ⇒ Requires distance, making high-precision difficult Through-tape imaging ⇒ Allows high-precision alignment at the bonding interface Notes Conventional method ⇒ Chips are individually picked, transferred, and bonded New method ⇒ Direct bonding from carrier tape (no re-handling) AI and metaverse processing demands highlight the limits of conventional ICs, driving interest in chiplet technology. We advance R&D through the Chiplet Consortium with academic and industry partners. Ongoing presentations at international conferences, strengthening external technical collaboration and refining our research for practical use. Chiplet Integration Platform Consortium
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© 2024 TAZMO Co.,Ltd. 27 DTB Future Prospects 0 10 20 30 2025 2026 2027 2028 2029 2030 2031 (Units) Shipment Forecast（2025-2031） 10 15 20 25 202520262027202820292030 ＄B Hybrid Bonding Technology Market Forecast Source：https://xtech.nikkei.com DTB’s Three Key Strengths Chip thickness 1um~775um Chip size □50um~28mm diagonal Bonding accuracy ＜50nm 1 2 3 ※2027 Performance Targets Bonding Accuracy Chip thicknessThroughput DTBCompetitors （Pick＆Place） ✓ Thin chips ✓ Fragile chips ✓ Warped chips In preparation for the 2027 mass-production release, we are conducting evaluations with many users and using the resulting data to accelerate order acquisition. Global Chiplet Market Size Chiplets split a large circuit into smaller chips, which are interconnected on an interposer and integrated into a single package. Global Market Size of Photonic Integrated Circuits (PICs) Non-Si materials（InP, LiNbO₃, etc. ） Si materials (trillion yen) (year) 1 trillion yen 8.56 trillion yen
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28 © 2024 TAZMO Co.,Ltd. Business Environment Demand for material handling equipment from equipment manufacturers, as well as deployment in the Chinese market, had been sluggish; however, the market is now showing signs of recovery. By placing greater emphasis on orders for material handling equipment including frames, we aim to increase average selling prices and improve profitability. Cleaning equipment has been affected by sluggish capital investment by wafer manufacturers; however, we are advancing efforts to develop new demand, including for compound semiconductors. We are also focusing on the order intake and sales of customized equipment, such as slurry supply systems. In the surface treatment equipment business, capital investment by automotive printed circuit board manufacturers remains sluggish amid a slow recovery in automotive demand. While preparing for a future recovery, we are also placing greater emphasis on orders for material handling equipment for printed circuit boards. Regarding power semiconductors, we see strong capital investment appetite over the medium to long term, driven by expected demand growth associated with the expansion of the EV market, renewable energy, and data centers. In the near term, we are focusing on investments in the Chinese market while preparing for a broader recovery in capital investment going forward. Driven primarily by AI devices, inquiries for panel-level equipment have surged due to increasing package sizes and the need forhigher productivity.Leveragingour expertise accumulated through FPD equipment, we are advancing process and equipment development of PLP tools for advanced packaging and are responding to a wide range of customer inquiries. Driven by the expansion of the AI-related market, production of devices utilizing advanced packaging technologies continues to grow steadily. Including the rollout of production lines to OSATs, demand for equipment for advanced packaging is expected to remain solid this fiscal year, and we will further expand customer coverage.
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29 © 2024 TAZMO Co.,Ltd. 16 19 24 33 34 34 2 2021/12 2022/12 2023 2024 2025 2026 Ordinary dividend 50th anniversary dividend FY2021 FY2022 FY2023 FY2024 FY2025 FY2026 （E） Net income attributable to owners of parent （Millions of yen） 1,749 2,263 2,356 4,247 3,541 2,500 Dividends per share（yen） 16.0 21.0 24.0 33.0 34.0 34.0 Dividend payout ratio（％） 12.1 13.0 14.9 11.4 13.9 19.9 FY2026 Dividend Forecast
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30© 2024 TAZMO Co.,Ltd. Appendix 05
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31 © 2024 TAZMO Co.,Ltd. Company name TAZMO Co., Ltd. Established February 26, 1972 Head office 5311, Haga, Kita -ku, Okayama -shi, Okayama 701 -1221, Japan Capital 356,859,682 yen Total number of issued shares 14,842,354 Number of shareholders 9,433 Number of employees Non-consolidated 449 Consolidated 1,150 Business content Development, Manufacturing and Sales of Semiconductor Manufacturing Equipment, Clean Transfer System, UV Laser Equipment, Plating Equipment, Mold ・Resin Molding, Plating/Circuit formation Equipment for PCB Company Info ▍Domestic locations, Subsidiaries Shinjuku-ku,Tokyo Tokyo office Ibara-shi, Okayama TAZMO Plant No.1 TAZMO Plant No.3 TAZMO Plant No.5 Quark Technology Co., Ltd. PRETEC Co., Ltd. ▍Global Network Vietnam TAZMO VIETNAM CO.,LTD. FACILITY HANOI CO.,LTD. Hong Kong Facility (HK) Co., Ltd. Shaoxing City, Zhejiang Province, China TAZMO Semitec Shaoxing Technology Co., Ltd. Doungguan City,Guangdong Province, China Facility Technology (Dongguan) Co., Ltd. Taiwan TAZMO Apprecia Formosa Inc. San Francisco TAZMO INC. Okayama-shi, Okayama Head office （as of Decembe 31, 2025）
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32 © 2024 TAZMO Co.,Ltd. Milestones - Began production of molding dies, including injection molding dies. - Completed development of Fully-automated Photo Resist Coater; production and sales started. - TAZMO Co., Ltd. is incorporated to manufacture and produce electronic components and repair industrial equipment. - Developed TFT Full-color filter manufacturing system; production and sales started. - Constructed new head office/plant at 6186 Kinoko-Cho, Ibara, Okayama - Developed and produced Ultra Compact Transfer System for Super Clean Room. - Began production and sales of Emboss Carrier Tape. - Began production of injection Molding Products. - Developed “CS13” series Photo Resist Coater specialized for a thicker film application; production and sales started. - Listed on the JASDAQ market. - Established TAZMO VIETNAM CO., LTD. a consolidated subsidiary, in Ho Chi Minh City, Vietnam. - Developed 10th generation compatible full-color filter manufacturing system; production and sales started. - Concluded a license agreement with 3M(USA) for semiconductor manufacturing equipment. - Apprecia Technology Inc. became our wholly owned subsidiary company. - VIETNAM CO., LTD. Constructed new factory at Long Hau Industrial Park in Long An Province, Vietnam. - Facility Co., Ltd. and Quark Technology Co., Ltd. became our wholly owned subsidiary company. - Listed on the First Section of the Tokyo Stock Exchange - Constructed a new head office at 5311 Haga Kita-ku, Okayama- shi, Okayama - Merged with Apprecia Technology Inc. - TAZMOʼs listing transferred to Prime Market in Tokyo Stock Exchange. - Increased capital to 3,495,400,000 yen through public offering. - Established TAZMO SEMITEC SHAOXING TECHNOLOGY Co., Ltd. a consolidated subsidiary, in Zhejiang Shaoxing, China. 2022 2020 2019 2018 2017 2013 20091972 1980 1989 1990 1994 1995 2001 2004 2008
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33 © 2024 TAZMO Co.,Ltd. Business Introduction Semiconductor Manufacturing Equipment Business Unit ⚫ For Advanced Packaging（WLP ※1／PLP ※2） ⚫ For Power Semiconductors ※1 WLP：Wafer-Level Packaging ※2 PLP ：Panel-Level Packaging Bonder / Debonder We develop, design, manufacture, and sell temporary bonding and debonding systems that enable wafer thinning, an essential process for the production of high-performance chips.By bonding wafers to glass carrier substrates, our systems allow wafer thinning while preventing damage to the wafers. Coater / Developer Leveraging the expertise gained through the development and manufacturing of FPD production equipment, we enable uniform chemical coating and precise circuit formation by selectively removing only the exposed areas during the development process. Transfer Business Unit ⚫ For Semiconductor Equipment Manufacturers (Wafers, Masks, and Related Components) We develop, design, manufacture, and sell transfer robots used in semiconductor manufacturing equipment, as well as EFEMs in which various units are integrated into frames. Cleaner Business Unit We develop, design, manufacture, and sell single-wafer cleaning systems for wafer manufacturers, as well as slurry supply systems and equipment that recovers and reuses phosphoric acid from waste liquids. Molding Business We provide plating systems for printed circuit boards used in semiconductor packages and electronic control systems for automobiles and other applications. Surface Treatment Business We provide precision molds and resin molded products for connector manufacturers.
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34 © 2024 TAZMO Co.,Ltd. ◼ Continuously monitors the Company’s CO₂ emissions and implements measures to achieve carbon neutrality through business activities ◼ Currently discloses CO₂ emissions on a standalone basis and plans to progressively expand monitoring and reduction efforts to the Group level ◼ Analyzes future climate-related risks and opportunities and identifies their potential financial impacts ◼ Based on these assessments, the Company will sequentially consider and implement the following measures: • Installed on-site solar power generation facilities for self-consumption (completed in September 2023) • Promoted company-wide conversion to LED lighting (completed in March 2023) • Transitioning to electricity derived from renewable energy sources • Gradually improving power efficiency through equipment upgrades ◼ Established a Sustainability Committee • Meets twice a year (January and July) • Works in coordination with the Board of Directors to determine sustainability initiatives and oversee company-wide efforts • For environmental initiatives, the Committee formulates policies and ensures company-wide communication and reporting ◼ Based on reports, instructs relevant departments to develop business strategies and medium-term plans, including risk mitigation measure Initiatives on Sustainability The Company discloses various information in accordance with the recommendations of the Task Force on Climate-related Financial Disclosures (TCFD).In addition, the Company received a “B” score in the Climate Change category in 2025 from CDP, an international environmental disclosure platform. Governance and Risk Management Strategy Metrics and Targets
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Forward-looking statements with respect to TAZMO’s business plan, prospects and other such information are based on information available at the time of publication. Actual performance and results may differ significantly from the business plan described here due to changes in various external and internal factors. This material takes as its objective the provision of information regarding the management policy, plans, and financial situation of TAZMO to shareholders, investors and other visitors. It constitutes neither an offer nor a solicitation to purchase or sell TAZMO stock. keiki@tazmo.co.jp Notes Management Plan Div. TAZMO CO., LTD. Contact